Mechanic TY-V866 Special Purpose Series gives fast welding speed, less spatter, bright solder joints, and adapts to the rapid development of the modern electronics industry and the needs of welding technology. It is a good material for the maintenance industry and electronics enthusiasts. Specification
Size available to choose 0.3 / 0.4 / 0.5 / 0.6mm
Gross Weight 40g
Tin/Lead Content Ratio: 63/37
CJ(Flux) 0.05%, Expansion 75%
Flux 1.0%-3.0%
Features
Excellent Tin wire for motherboards & Mobile phones repair works
High tin content, plump solder joints and good soldering ability
Contains rosin with low melting point, continuous core
Raw materials are used, in strict accordance with the requirements of GB3131-82
Suitable for the majority of maintenance masters
Note: Please choose the right size for your requirement before placing your order.
A superb leaded solder paste. Sn63/Pb37 eutectic formula goes directly from a liquid to solid state as it cools and vise-versa. Great for reballing BGA chips with stencils, soldering connectors, and more!
Suitable for mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.Features
Flux: IPX3Alloy: Sn63 Pb37Lead solder paste, melting point, 183℃Microns/Granularity :3 (um)Strong viscosity; fine particles; fine pasteExcellent wettability: the surface after being opened for a long timeIt is still wet and does not affect weldingResistant to medium temperature, less residue, strong upper tin, bright soldering spotWorking temperature: 200 (℃)
Mechanic UV50 Solder Paste Tflux is a butter-like ointment with high bonding strength, neutral pH, strong insulation and smooth welding surface. It is suitable for flux soldering in precision electronic product, PCB, BGA, etc.
High quality soldering flux with excellent performance.
Use without concerns – not corrosiveto integrated circuit board.
Its boiling point is slightly higher than that of soldering tin.
Lightweight with small volume, easy and convenient to use.
Easy and durable soldering with this flux, as well as fast cleaningand good insulation.
Ideal for flux soldering in precision electronic product, PCB, BGA,etc.
Instructions:
Wipe the surface of the object before soldering.
Apply the paste flux to the solder joint.
Solder the tin to the solder joint with soldering iron.
Mechanic XG30 Lead-Free Soldering Paste is a high-quality, lead-free soldering paste that is ideal for PCB, mobile phone repair, and BGA welding applications. It has a low melting point of 183°C, making it easy to use and preventing the solder from solidifying before it can be applied. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance.
Alloy Sn63 / Pb37
Rosin flux IPX3
Microns 3#
Produces high-quality solder joints
Benefits:
Repairs PCB circuit boards
Solders electronic components
Performs BGA welding
Repairs mobile phones
Easy to use
Produces high-quality solder joints
Consistent and reliable performance
Applications:
PCB repair
Electronic component soldering
BGA welding
Mobile phone repair
Mechanic XGSP80 Lead-Free Soldering Paste is a high-quality, lead-free soldering paste that is ideal for PCB, mobile phone repair, and BGA welding applications. It is made with a tin-lead alloy and a rosin flux, which makes it easy to use and produces high-quality solder joints. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance.
Alloy Sn63 Pb37
Rosin flux IPX3
Microns 3#
Easy to use
Produces high-quality solder joints
Benefits:
Repairs PCB circuit boards
Solders electronic components
Performs BGA welding
Repairs mobile phones
Easy to use
Produces high-quality solder joints
Consistent and reliable performance
Applications:
PCB repair
Electronic component soldering
BGA welding
Mobile phone repair
