Soldering

IVES Lead-Free BGA Ball Mounting Flux Paste is a high-quality, lead-free solder paste that is ideal for mobile phone repair, chip planting, and electronic component soldering applications. It is made with a tin-silver-copper alloy and a rosin flux, which makes it easy to use and produces high-quality solder joints. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance. Features: Lead-free Tin-silver-copper alloy Rosin flux Easy to use Produces high-quality solder joints Viscosity and graininess controlled Ideal for BGA ball mounting, mobile phone repair, chip planting, and electronic component soldering applications Small size, easy to carry Benefits: Repairs PCB circuit boards Solders electronic components Performs BGA welding Repairs mobile phones Easy to use Produces high-quality solder joints Consistent and reliable performance Portable and easy to carry Applications: BGA ball mounting Mobile phone repair Chip planting Electronic component soldering

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IVES 100g Lead-Free BGA Solder Paste is a high-quality, no-clean flux paste that is ideal for PCB, mobile phone repair, soldering, and rework applications. It is made with lead-free solder and a wash-free rosin flux, which makes it environmentally friendly and easy to use. The solder paste has a high activity and low halogen content, making it ideal for use in a variety of electronic products. It is also viscosity and graininess controlled, ensuring a consistent and reliable performance. Here are some of the key features of the IVES BGA Solder Paste: Lead-free solder, Wash-free rosin flux Environmentally friendly, Easy to use High activity, Low halogen content Viscosity and graininess controlled Ideal for PCB, mobile phone repair, soldering, and rework applications

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