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JASTON JSD-3180 Soldering Paste 100g, No-Clean Lead-Free for PCB, Mobile Phone Repair, and BGA Welding

Description

Jaston JSD-3180 No-Clean Lead-Free Soldering Paste is a high-quality, no-clean lead-free soldering paste that is ideal for PCB, mobile phone repair, and BGA welding applications. It is made with a tin-silver-copper alloy and a rosin flux, which makes it easy to use and produces high-quality solder joints. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance.

  • Viscosity: 100 mPa·s
  • Graininess: 20 μm
  • Alloy composition: Rosin
  • Melting point: 180°C
  • Type: Soldering paste
  • Operating temperature: 300°C

Features:

  • No-clean
  • Lead-free
  • Tin-silver-copper alloy
  • Rosin flux
  • Easy to use
  • Produces high-quality solder joints
  • Viscosity and graininess controlled
  • Ideal for PCB, mobile phone repair, and BGA welding application
  • Repairs PCB circuit boards
  • Solders electronic components
  • Performs BGA welding
  • Repairs mobile phones
  • No need to clean after use
  • Produces high-quality solder joints
  • Consistent and reliable performance

Applications:

  • PCB repair
  • Electronic component soldering
  • BGA welding
  • Mobile phone repair
Product form

Jaston JSD-3180 No-Clean Lead-Free Soldering Paste is a high-quality, no-clean lead-free soldering paste that is ideal for PCB, mobile phone... Read more

5 in stock

Dhs. 24.95 Incl. VAT

    • Shipped today? Order within: Jul 16, 2024 13:00:00 +0400

    Description

    Jaston JSD-3180 No-Clean Lead-Free Soldering Paste is a high-quality, no-clean lead-free soldering paste that is ideal for PCB, mobile phone repair, and BGA welding applications. It is made with a tin-silver-copper alloy and a rosin flux, which makes it easy to use and produces high-quality solder joints. The solder paste is also viscosity and graininess controlled, ensuring a consistent and reliable performance.

    • Viscosity: 100 mPa·s
    • Graininess: 20 μm
    • Alloy composition: Rosin
    • Melting point: 180°C
    • Type: Soldering paste
    • Operating temperature: 300°C

    Features:

    • No-clean
    • Lead-free
    • Tin-silver-copper alloy
    • Rosin flux
    • Easy to use
    • Produces high-quality solder joints
    • Viscosity and graininess controlled
    • Ideal for PCB, mobile phone repair, and BGA welding application
    • Repairs PCB circuit boards
    • Solders electronic components
    • Performs BGA welding
    • Repairs mobile phones
    • No need to clean after use
    • Produces high-quality solder joints
    • Consistent and reliable performance

    Applications:

    • PCB repair
    • Electronic component soldering
    • BGA welding
    • Mobile phone repair

    Reviews

    JASTON JSD-3180 Soldering Paste 100g, No-Clean Lead-Free for PCB, Mobile Phone Repair, and BGA Welding

    JASTON JSD-3180 Soldering Paste 100g, No-Clean Lead-Free for PCB, Mobile Phone Repair, and BGA Welding

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