Description
The JASTON JSD-559X-TF is a lead-free BGA solder paste that is perfect for mobile phone repair. It is no-clean, environmentally, and has a low halogen content. The solder paste has a viscosity of 100 (Pa·S) and a graininess of 0 (um). It is made with a solder oil alloy that has a melting point of 180 degrees Celsius. The solder paste is also compatible with a wide range of electronic components.
Key Features:
- Lead-free, No-clean, Environmentally friendly
- Low halogen, High transfer efficiency, Rosin flux
- Good liquidity, Bright solder joints, Little smoke
Applications:
- Mobile phone repair
- PCB, BGA, CSP and other packages
- CSP rework
- Other electronic assembly applications
