Description
A superb leaded solder paste. Sn63/Pb37 eutectic formula goes directly from a liquid to solid state as it cools and vise-versa. Great for reballing BGA chips with stencils, soldering connectors, and more!
Suitable for mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.
Features
Flux: IPX3
Alloy: Sn63 Pb37
Lead solder paste, melting point, 183℃
Microns/Granularity :3 (um)
Strong viscosity; fine particles; fine paste
Excellent wettability: the surface after being opened for a long time
It is still wet and does not affect welding
Resistant to medium temperature, less residue, strong upper tin, bright soldering spot
Working temperature: 200 (℃)
