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JASTON 0.3 0.5 0.6 0.8 1.0mm Soldering Wire Tin/Lead Sn63/Pb37 High Purity Active Solder Wire JSD-9003

Description

JASTON JSD-9003 is high purity disposable active solder wire. This Leaded solder wire Sn63/Pb37 is available in various diameter size, It is best choice for repairing of sophisticated equipment's such as mobile phone motherboard gives fast welding speed, less spatter, bright solder joints, and adapts to the rapid development of the modern electronics industry and the needs of welding technology. It is a good material for the maintenance industry and electronics enthusiasts.

Specification
  • Diameter Size available to choose 0.3 / 0.5 / 0.6 / 0.8 / 1.0mm
  • Gross Weight 50g
  • Tin/Lead Content Ratio: 63/37
  • Expansion 75%
  • Flux 1.0%-3.0% (Flux with Rosin)
Features
  • Melting point with lead: 183-200°C, Leaded working temperature: 300-350°C
  • Excellent Tin wire for motherboards & Mobile phones repair works
  • High tin content, plump solder joints and good soldering ability
  • Contains rosin with low melting point, continuous core
  • Raw materials are used, in strict accordance with the requirements of GB3131-82
  • Suitable for the majority of maintenance masters

Note: Please choose the right size for your requirement before placing your order.

Product form

JASTON JSD-9003 is high purity disposable active solder wire. This Leaded solder wire Sn63/Pb37 is available in various diameter size,... Read more

5 in stock

Dhs. 18.99 Incl. VAT

    • Shipped today? Order within: Apr 25, 2024 13:00:00 +0400

    Description

    JASTON JSD-9003 is high purity disposable active solder wire. This Leaded solder wire Sn63/Pb37 is available in various diameter size, It is best choice for repairing of sophisticated equipment's such as mobile phone motherboard gives fast welding speed, less spatter, bright solder joints, and adapts to the rapid development of the modern electronics industry and the needs of welding technology. It is a good material for the maintenance industry and electronics enthusiasts.

    Specification
    • Diameter Size available to choose 0.3 / 0.5 / 0.6 / 0.8 / 1.0mm
    • Gross Weight 50g
    • Tin/Lead Content Ratio: 63/37
    • Expansion 75%
    • Flux 1.0%-3.0% (Flux with Rosin)
    Features
    • Melting point with lead: 183-200°C, Leaded working temperature: 300-350°C
    • Excellent Tin wire for motherboards & Mobile phones repair works
    • High tin content, plump solder joints and good soldering ability
    • Contains rosin with low melting point, continuous core
    • Raw materials are used, in strict accordance with the requirements of GB3131-82
    • Suitable for the majority of maintenance masters

    Note: Please choose the right size for your requirement before placing your order.

    Reviews

    JASTON 0.3 0.5 0.6 0.8 1.0mm Soldering Wire Tin/Lead Sn63/Pb37 High Purity Active Solder Wire JSD-9003

    JASTON 0.3 0.5 0.6 0.8 1.0mm Soldering Wire Tin/Lead Sn63/Pb37 High Purity Active Solder Wire JSD-9003

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