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JASTON JSD-16S Lead-Based BGA Rework Solder Paste 50g with Tin-Lead Alloy for Mobile Phone Repair, Chip Planting, and Electronic Component Soldering

Description

JASTON JSD-16S is a lead-based BGA rework solder paste with a tin-lead alloy. It is ideal for mobile phone repair, chip planting, and electronic component soldering applications. The solder paste is easy to use and produces high-quality solder joints. It is also viscosity and graininess controlled, ensuring a consistent and reliable performance.

Features:

  • Lead-based
  • Tin-lead alloy
  • Rosin flux
  • Easy to use
  • Produces high-quality solder joints
  • Viscosity and graininess controlled
  • Ideal for BGA rework, mobile phone repair, chip planting, and electronic component soldering applications
  • Small size, easy to carry

Benefits:

  • Repairs PCB circuit boards
  • Solders electronic components
  • Performs BGA welding
  • Repairs mobile phones
  • Easy to use
  • Produces high-quality solder joints
  • Consistent and reliable performance
  • Portable and easy to carry

Applications:

  • BGA rework
  • Mobile phone repair
  • Chip planting
  • Electronic component soldering
Product form

JASTON JSD-16S is a lead-based BGA rework solder paste with a tin-lead alloy. It is ideal for mobile phone repair, chip... Read more

Barcode: 6973854830007

5 in stock

Dhs. 24.95 Incl. VAT

    • Shipped today? Order within: Jul 24, 2024 13:00:00 +0400

    Description

    JASTON JSD-16S is a lead-based BGA rework solder paste with a tin-lead alloy. It is ideal for mobile phone repair, chip planting, and electronic component soldering applications. The solder paste is easy to use and produces high-quality solder joints. It is also viscosity and graininess controlled, ensuring a consistent and reliable performance.

    Features:

    • Lead-based
    • Tin-lead alloy
    • Rosin flux
    • Easy to use
    • Produces high-quality solder joints
    • Viscosity and graininess controlled
    • Ideal for BGA rework, mobile phone repair, chip planting, and electronic component soldering applications
    • Small size, easy to carry

    Benefits:

    • Repairs PCB circuit boards
    • Solders electronic components
    • Performs BGA welding
    • Repairs mobile phones
    • Easy to use
    • Produces high-quality solder joints
    • Consistent and reliable performance
    • Portable and easy to carry

    Applications:

    • BGA rework
    • Mobile phone repair
    • Chip planting
    • Electronic component soldering

    Reviews

    JASTON JSD-16S Lead-Based BGA Rework Solder Paste 50g with Tin-Lead Alloy for Mobile Phone Repair, Chip Planting, and Electronic Component Soldering

    JASTON JSD-16S Lead-Based BGA Rework Solder Paste 50g with Tin-Lead Alloy for Mobile Phone Repair, Chip Planting, and Electronic Component Soldering

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