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MXJ 0.3 0.5 0.6 0.8 1.0mm Soldering Wire Tin/Lead Sn63/Pb37 Leaded Rosin Flux Solder Wire MXJ-8003

Description

MXJ-8003 is Leaded & Rosin Flux solder wire Sn63/Pb37. This Leaded solder wire is available in various diameter size, It is best choice for repairing of sophisticated equipment's such as mobile phone motherboard gives fast welding speed, less spatter, bright solder joints, and adapts to the rapid development of the modern electronics industry and the needs of welding technology. It is a good material for the maintenance industry and electronics enthusiasts.

Specification

  • Diameter Size available to choose 0.3 / 0.5 / 0.6 / 0.8 / 1.0mm
  • Gross Weight 100g
  • Tin(Sn) 63%, Lead(Pb) 37%
  • Expansion 75%
  • Flux 1.0%-3.0% (Flux with Rosin)

Features

  • Melting point with lead: 183-200°C, Leaded working temperature: 300-350°C
  • Excellent Tin wire for motherboards & Mobile phones repair works
  • High tin content, plump solder joints and good soldering ability
  • Contains rosin with low melting point, continuous core
  • Raw materials are used, in strict accordance with the requirements of GB3131-82
  • Suitable for the majority of maintenance masters

Note: Please choose the right size for your requirement before placing your order.

Product form

MXJ-8003 is Leaded & Rosin Flux solder wire Sn63/Pb37. This Leaded solder wire is available in various diameter size, It... Read more

5 in stock

Dhs. 24.95 Incl. VAT

    • Shipped today? Order within: Apr 25, 2024 13:00:00 +0400

    Description

    MXJ-8003 is Leaded & Rosin Flux solder wire Sn63/Pb37. This Leaded solder wire is available in various diameter size, It is best choice for repairing of sophisticated equipment's such as mobile phone motherboard gives fast welding speed, less spatter, bright solder joints, and adapts to the rapid development of the modern electronics industry and the needs of welding technology. It is a good material for the maintenance industry and electronics enthusiasts.

    Specification

    • Diameter Size available to choose 0.3 / 0.5 / 0.6 / 0.8 / 1.0mm
    • Gross Weight 100g
    • Tin(Sn) 63%, Lead(Pb) 37%
    • Expansion 75%
    • Flux 1.0%-3.0% (Flux with Rosin)

    Features

    • Melting point with lead: 183-200°C, Leaded working temperature: 300-350°C
    • Excellent Tin wire for motherboards & Mobile phones repair works
    • High tin content, plump solder joints and good soldering ability
    • Contains rosin with low melting point, continuous core
    • Raw materials are used, in strict accordance with the requirements of GB3131-82
    • Suitable for the majority of maintenance masters

    Note: Please choose the right size for your requirement before placing your order.

    Reviews

    MXJ 0.3 0.5 0.6 0.8 1.0mm Soldering Wire Tin/Lead Sn63/Pb37 Leaded Rosin Flux Solder Wire MXJ-8003

    MXJ 0.3 0.5 0.6 0.8 1.0mm Soldering Wire Tin/Lead Sn63/Pb37 Leaded Rosin Flux Solder Wire MXJ-8003

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